Heat sink

ABSTRACT

A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device and ambient air. The inner surface defines a cavity within the heat dissipation device that also enables housing of the electrical components.

TECHNICAL FIELD

The present invention relates to a device for dissipating heat fromelectrical components.

BACKGROUND

Heat dissipation devices, such as heat sinks are commonly used in theelectronics industry to dissipate heat from electrical components.Conventional heat sinks are comprised of a metallic material that isformed to have extruded profiles, which enable the transfer of heat fromthe electrical components to the heat sink. In some cases, the heat sinkis comprised of a solid metallic material that is mounted adjacent tothe electrical components. Alternatively, the heat sink may be designedas an electronic module wherein the electrical components are assembledwithin an inner cavity of the heat sink. An example of this alternativeembodiment includes sub-woofer amplifiers that are commonly used in theautomotive industry. In such an implementation, the heat sink includesan extruded profile (internally and externally) that include a pluralityof external fins for dissipating heat from electrical components thatare enclosed within a cavity of the heat sink. Conventional electronicsthat are mounted within the cavity of the heat sink include surfacemount devices (SMD) and leaded devices.

SMDs are electronic components which have terminal leads that are partof the component body, thus allowing direct mounting on the surface of aprinted circuit board. Leaded devices are those devices which aremounted by their electrical leads through holes within the printedcircuit board. Conventionally, the installation of SMDs and leadeddevices within a heat sink has been accomplished through the use ofsprings and bolts which are configured to stabilize these componentswithin the heat sink. Additionally, these springs and bolts are fastenedor press-fit onto the internal extrusions and are formed to contact theelectrical components. It is recognized that the requirement of springsand bolts increases manufacturing and assembly time, the cost of theelectrical component/heat sink assembly, and the potential for productmalfunction. Furthermore, the extruded internal profile of theconventional heat sinks increases the complexity of the heat sinkmanufacturing process.

The present invention was conceived in the view of these and otherdisadvantages of conventional heat sinks.

SUMMARY

The present invention provides a heat dissipation device for electricalcomponents. The device includes an outer surface configured for mountingthe electrical components thereon, wherein the components are mounted tothe outer surface to allow the transfer of heat from the electricalcomponents to the heat dissipation device and ambient air. The heatdissipation device also includes an inner surface that defines a cavitywithin the heat dissipation device.

A method for dissipating heat from electrical components through the useof a heat dissipation device is also disclosed. The method includesconfiguring the heat dissipation device to have an outer surface and aninner surface, wherein the inner surface defines a cavity within theheat dissipation device. The method also includes mounting theelectrical components on the outer surface of the heat dissipationdevice to allow the transfer of heat from the electrical components tothe heat dissipation device and ambient air.

The above embodiments and other embodiments, features, and advantages ofthe present invention are readily apparent from the following detaileddescription of the best mode for carrying out the invention when takenin connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The features of the present invention which are believed to be novel areset forth with particularity in the appended claims. The presentinvention, both as to its organization and manner of operation, togetherwith further objects and advantages thereof, may be best understood withreference to the following description, taken in connection with theaccompanying drawings in which:

FIGS. 1A-1C illustrate multiple views of a heat sink according to anembodiment of the present invention; and

FIGS. 2A-2D illustrate multiple views of an alternative embodiment of aheat sink according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

As required, detailed embodiments of the present invention are disclosedherein. However, it is to be understood that the disclosed embodimentsare merely exemplary of the invention that may be embodied in variousand alternative forms. The figures are not necessarily to scale, andsome features may be exaggerated or minimized to show details ofparticular components. Therefore, specific functional details disclosedherein are not to be interpreted as limiting, but merely as arepresentative basis for the claims and/or as a representative basis forteaching one skilled in the art to variously employ in the presentinvention.

Referring to FIG. 1A, a cross-sectional view of a heat sink according toan embodiment of the present invention is shown. Heat sink 10 includesan outer surface 12 and an inner surface 14. As recognized by one ofordinary skill in the art, heat sink 10 may be formed of a metallic typematerial such as copper, aluminum, and the like. Inner surface 14defines a cavity 15 in which electrical components may be housed. Cavity15 includes a lower cavity surface 16 and an upper cavity surface 18 asdefined by inner surface 14.

Outer surface 12 also defines a side cavity 17. Accordingly, electricalcomponents such as leaded device 26 may be mounted on outer surface 12of heat sink 10. A printed circuit board (PCB) 20 may be positionedwithin heat sink 10 for mounting of surface mount devices (SMD) 22 andleaded device 26. Leaded device 26 is connected to PCB 20 via leads 26a. Leaded device 26 may be mounted to outer surface 12 through the useof a gap pad or a paste that is disposed between leaded device 26 andouter surface 12.

Additionally, in one embodiment, at least one side of SMD 22 contactsupper cavity surface 18 thereby enabling the dissipation of heat fromSMD 22 to heat sink 10. A cover 28 having an upper cover portion 28 band a side cover portion 28 c encloses cavity 15 and side cavity 17.Cover 28 includes protrusions 28 a that provide a heat dissipationcontact surface for SMD 22 and leaded device 26.

Now referring to FIG. 1B, a perspective view of heat sink 10 is shownabsent PCB 20 and cover 28. FIG. 1B illustrates an embodiment whereinmultiple SMDs 22 are configured to form a single row on upper cavitysurface 18. Additionally, a plurality of leaded devices 26 are mountedwithin side cavity 17, which is defined by outer surface 12. As shown inboth FIGS. 1A and 1B, inner surface 14 of heat sink 10, which includeslower cavity surface 16 and upper cavity surface 18, does not requirefastening devices (e.g., bolts and springs) to secure SMDs 22.Accordingly, in one aspect of the invention, inner surface 14 does notrequire extrusions or projections for attaching the fastening devices.Additionally, mounting of leaded devices 26 to outer surface 12 does notrequire extrusions or fastening devices. As such, the process ofmanufacturing heat sink 10 and assembling of heat sink 10 with theelectrical components is improved in contrast with conventional heatsinks.

Now referring to FIG. 1C, a perspective view of heat sink 10 is shownhaving cover 28 attached thereto. As described above, cover 28 includesmultiple protrusions 28 a. Accordingly, upper cover portion 28 b andside cover portion 28 c both include protrusions 28 a. It is recognizedthat the embodiments shown do not limit the scope of the presentinvention and other embodiments may include additional or lessprotrusions 28 a without departing from the scope of the presentinvention. FIG. 1C also illustrates a plurality of mounting apertures 28that enable mounting of cover 28 to heat sink 10.

Now referring to FIG. 2A, an exploded cross-sectional view of analternative embodiment of heat sink 10 including cover 28 is shown. Theembodiment shown in FIG. 2A includes multiple upper cavity surfaces 18.As such, SMDs 22 may be mounted on one or both upper cavity surfaces 18.Leaded devices 26 are also mounted within cavity 17 as defined by outersurface 12. Each row of SMDs 22 is mounted to PCB 20. Accordingly, oneside of SMD 22 contacts upper cavity surfaces 18. Protrusions 28 a, asdescribed above, are configured to provide a heat dissipation contactsurface for SMDs 22 via PCB 20. Also, protrusion 28 a, being integratedwith side cover portion 28 c is also configured to provide a heatdissipation contact surface for leaded devices 26.

Now referring to FIG. 2B, a perspective view of heat sink 10 isillustrated. As described above, heat sink 10 may have multiple uppercavity surfaces 18 for mounting SMDs 22 thereon. FIG. 2B alsoillustrates a connecter terminal 30 that enables the electricalcomponents coupled to and integrate with heat sink 10 to be connectedwith a power source or other adjacent systems.

Now referring to FIG. 2C, an enlarged cross-sectional view of sidecavity 17 is illustrated. As shown, leaded device 26 being mounted toouter surface 12, is connected to PCB 20 via leads 26 a. Additionally,side cover portion 28 c encloses cavity 17 and includes protrusion 28 awhich contacts leaded device 26 for dissipating heat.

Now referring to FIG. 2D, heat sink 10 is shown having cover 28 attachedthereto. As described above, cover 28 includes multiple protrusions 28 athat are capable of providing a contact surface for electricalcomponents mounted to heat sink 10. Cover 28 includes an additionalprotrusion 28 a which provides the contact surface for the additionalrow of SMDs 22 (FIG. 2B). Accordingly, a connecter terminal 30 isillustrated for connecting heat sink 10 and the electrical componentswith adjacent electrical systems or devices.

While embodiments of the invention have been illustrated and described,it is not intended that these embodiments illustrate and describe allpossible forms of the invention. Rather, the words used in thespecification are words of description rather than limitation, and it isunderstood that various changes may be made without departing from thespirit and scope of the invention.

1. A heat dissipation device for electrical components comprising: an outer surface configured for mounting the electrical components thereon, wherein the components are mounted to the outer surface to allow the transfer of heat from the electrical components to the heat dissipation device; and an inner surface that defines a cavity within the heat dissipation device.
 2. A device according to claim 1, wherein the electrical components are mounted to the outer surface of the heat dissipation device through the use of a gap pad or a paste that is disposed between the electrical component and the outer surface.
 3. A device according to claim 1, further comprising a cover having an upper cover portion and the cover being attachable to the heat dissipation device.
 4. A device according to claim 3, wherein the cover includes a protrusion configured to provide a contact surface for surface mount devices.
 5. A device according to claim 4, further comprising a circuit board being disposed between the protrusion and the surface mount devices.
 6. A device according to claim 3, wherein the cover has a side cover portion that includes a protrusion configured to contact the electrical component.
 7. A device according to claim 1, wherein the inner surface is substantially void of extrusions.
 8. A device according to claim 1, wherein the outer surface being configured for mounting the electrical components thereon is further configured to define a side cavity in which leaded devices are mounted.
 9. A device according to claim 1, wherein the inner surface is substantially void of fastening devices.
 10. A device according to claim 1, wherein the inner surface that defines a cavity includes a cavity having a lower cavity surface and an upper cavity surface.
 11. A device according to claim 10, wherein the upper cavity surface is configured to provide a surface in which surface mount devices are mounted.
 12. A device according to claim 10, wherein the inner surface that defines a cavity, includes a cavity having multiple upper cavity surfaces.
 13. A method of dissipating heat from electrical components through the use of a heat dissipation device, the method comprising: configuring the heat dissipation device to have an outer surface and an inner surface, wherein the inner surface defines a cavity within the heat dissipation device; and mounting the electrical components on the outer surface of the heat dissipation device to allow the transfer of heat from the electrical components to the heat dissipation device.
 14. A method according to claim 13, further including configuring the heat dissipation device to include a cover that is attachable thereto that has an upper cover portion and a side cover portion.
 15. A method according to claim 14, wherein configuring the heat dissipation device to include a cover having an upper cover portion and a side cover portion includes an upper cover portion and a side cover portion having at least one protrusion for contacting electrical components.
 16. A method according to claim 13, wherein the inner surface which defines a cavity within the heat dissipation device is a substantially void of extrusions.
 17. A method according to claim 13, wherein the inner surface is substantially void of fastening devices.
 18. A method according to claim 13, wherein configuring the heat dissipation device to have the inner surface that defines a cavity includes a cavity having a lower cavity surface and an upper cavity surface, wherein the upper cavity surface is adapted for mounting surface mount devices thereon.
 19. A method according to claim 18, wherein configuring the heat dissipation device to have the inner surface having a lower cavity surface and an upper cavity surface further includes a inner surface having multiple upper cavity surfaces for mounting surface mount devices thereon.
 20. A method according to claim 13, wherein mounting the electrical components on the outer surface of the heat dissipation device includes mounting the electrical components within a side cavity defined by the outer surface, wherein the electrical components include leaded devices. 